multilayer ceramic chip capacitors 1 of 3 creation date : november 14, 2017 (gmt) CGA3E2X7R1H104M080AE tdk item description cga3e2x7r1h104mt***s applications automotive grade feature soft soft termination aec-q200 aec-q200 series cga3(1608) [eia 0603] status production size length(l) 1.60mm +0.20,-0.10mm width(w) 0.80mm +0.15,-0.10mm thickness(t) 0.80mm +0.15,-0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 100nf 20% rated voltage 50vdc temperature characteristic x7r(15%) dissipation factor (max.) 3% insulation resistance (min.) 5000m other soldering method wave (flow) re?ow aec-q200 yes packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : november 14, 2017 (gmt) CGA3E2X7R1H104M080AE characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance CGA3E2X7R1H104M080AE esr CGA3E2X7R1H104M080AE capacitance CGA3E2X7R1H104M080AE dc bias characteristic CGA3E2X7R1H104M080AE temperature characteristic CGA3E2X7R1H104M080AE(no bias) CGA3E2X7R1H104M080AE(dc bias = 25v) ripple temperature rising CGA3E2X7R1H104M080AE(100khz) CGA3E2X7R1H104M080AE(500khz) CGA3E2X7R1H104M080AE(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : november 14, 2017 (gmt) CGA3E2X7R1H104M080AE associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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